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CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment

案件編號 f998f058-6d38-4613-b732-51b5dbeb3a96
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CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment

Agency

Agency: National Institute of Standards and Technology

Assistance Listings

Assistance Listings: 11.037 -- CHIPS Incentives Program

Last Updated

Last Updated: May 13, 2026

Description

The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment.

For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov. If you have any questions on how to apply, please email apply@chips.gov.

Eligibility

Eligible applicants

  • Other (under Miscellaneous)

Additional information

An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors or semiconductor manufacturing equipment.

Grantor contact information

Description: Misty Roosa Management Analyst Email: apply@chips.gov

Documents

File name Description Last updated
CHIPS_-_Facilities_for_Semiconductor_Materials_and_Manufacturing_Equipment_NOFO.pdf 2023-NIST-CHIPS-SMME-01 Sep 27, 2023 08:40 PM UTC
2023-NIST-CHIPS-SMME-01-Amendment.pdf 2023-NIST-CHIPS-SMME-01 Amendment Oct 16, 2025 08:46 PM UTC

Link to additional information

CHIPS Application Portal

Closing

Closing: November 1, 2026

Application process

This site is a work in progress. Go to www.grants.gov to apply, track application status, and subscribe to updates.

Award

  • Program Funding: $--
  • Expected awards: --
  • Award Minimum: $--
  • Award Maximum: $--

Funding opportunity number

Funding opportunity number: 2023-NIST-CHIPS-SMME-01

Cost sharing or matching requirement

Cost sharing or matching requirement: No

Funding instrument type

Funding instrument type: Cooperative agreement

Opportunity Category

Opportunity Category: Discretionary

Opportunity Category Explanation

Opportunity Category Explanation: --

Category of Funding Activity

Category of Funding Activity: Science technology and other research and development

Category Explanation

Category Explanation: --

History

  • Version: 10
  • Posted date: September 29, 2023
  • Archive date: December 1, 2026
原始公告頁(部分政府網站禁止內嵌,空白時請點右側連結) ↗ 新分頁開啟

正規化數據

類型計劃徵求 ・ 開放中
出資方National Institute of Standards and Technology
主辦/執行National Institute of Standards and Technology
領域標籤製造與材料
申請期間📅 ? ~ 2026-11-01
公告日期(未取得)
經費(未取得)
申請資格
  1. 非營利實體
  2. 私營部門實體
  3. 私營部門實體聯盟
  4. 非營利、公共和私營部門實體聯盟,且具備顯著融資、建造、擴充或現代化半導體相關設施的能力(包括製造、組裝、測試、先進封裝、生產或研發)
摘要

此計畫旨在透過資助半導體材料與製造設備的商業設施建置、擴充或現代化,提升美國國內半導體產業的長期經濟永續成長,以支援國家經濟與國家安全。

入庫時間2026-09-02 19:46 ・ 最近重訪 2026-09-02 19:46

附件(2)

⏳ CHIPS_-_Facilities_for_Semiconductor_Materials_and_Manufacturing_Equipment_NOFO.pdf 待下載(連結已驗證,原始檔案尚未取回) ↗ 原始連結
⏳ 2023-NIST-CHIPS-SMME-01-Amendment.pdf 待下載(連結已驗證,原始檔案尚未取回) ↗ 原始連結
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